LX5510

C

L

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

Copyright

 2003

Rev. 0.3g, 2003-05-08

InGaP HBT 2.4 – 2.5 GHz Power Amplifier

I N T E GR A T ED

PRODUCT S

ABSOLUTE MAXIMUM RATINGS

DC Supply Voltage, RF off ...............................................................................6V

Collector Current ........................................................................................400mA

Total Power Dissipation....................................................................................2W

RF Input Power........................................................................................... 15dBm

Operation Ambient Temperature ...................................................-40°C to +85°C

Storage Temperature....................................................................-60°C to +150°C

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal

.

x denotes respective pin designator 1, 2, or 3

PACKAGE PIN OUT

RF IN

RF IN

RF OUT

RF OUT

VC2

2

3

4

5

6

7

8

9

10

11

12

13 14 15 16

* Pad is Ground

GND

GND

GND

(Bottom View)

FUNCTIONAL PIN DESCRIPTION

Name

Description

RF IN

RF input for the power amplifier. This pin is DC-shorted to GND but AC-coupled to the transistor base of the first

stage.

VB1

Bias current control voltage for the first stage.

VB2

Bias current control voltage for the second stage. The VB2 pin can be connected with the first stage control

voltage (VB1) into a single reference voltage (referred to as Vref) through an external resistor bridge.

VCC

Supply voltage for the bias reference and control circuits. This pin can be combined with both VC1 and VC2

pins, resulting in a single supply voltage (referred to as Vc).

RF OUT

RF output for the power amplifier.

VC1

Power supply for first stage amplifier. The VC1 feedline should be terminated with a 4pF bypass capacitor 50mil

apart from the device, followed by a 8.2nH blocking inductor at the supply side. This pin can be combined with

VC2 and VCC pins, resulting in a single supply voltage (referred to as Vc).

VC2

Power supply for second stage amplifier. The VC2 feedline should be driven with a 8.2nH AC blocking inductor

and 1uF bypass capacitor. This pin can be combined with VC1 and VCC pins, resulting in a single supply

voltage (referred to as Vc).

GND

The center metal base of the MLP package provides both DC and RF ground as well as heat sink for the power

amplifier.