MC33064DM datasheet(2/10 Pages) MICROSEMI

2 / 10 page

TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT

MC33064/MC34064

PRODUCT DA T ABOOK 1996/1997

Rev. 1.3

6/99

P RODUCTION

D AT A

S HEET

ABSOLUTE MAXIMUM RATINGS

(Note 1)

Input Supply Voltage (V

IN) ............................................................................... -1V to 10V

RESET Output Voltage (V

OUT) ..................................................................................... 10V

Output Sink Current (I

OL) ............................................................ Internally Limited (mA)

Clamp Diode Forward Current (I

F), Pin 1 to pin 2 ............................................... 100mA

Operating Junction Temperature

Plastic (DM, LP - Packages) .................................................................................. 150°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C

PACKAGE PIN OUTS

DM PACKAGE

(Top View)

Note 1. Values beyond which damage may occur. All voltages are specified with respect to

ground, and all currents are positive into the specified terminal.

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

165°C/W

LP PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

156°C/W

Junction Temperature Calculation:

J = TA + (PD x θJA).

The

JA numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow

THERMAL DATA

BLOCK DIAGRAM

LP PACKAGE

(Top View)

3. GROUND

2. V

1. RESET

RESET

N.C.

GROUND

N.C.

1.2 V

REF

RESET

GROUND

MC33064DM Datasheet(PDF) 2 Page - Microsemi Corporation

MC33064DM Datasheet(HTML) 2 Page - Microsemi Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10

Datasheet Download

Link URL