UC184xA/284xA/384xA

PRODUCT DA T ABOOK 1996/1997

Copyright © 1995

Rev. 1.2

12/95

2

ABSOLUTE MAXIMUM RATINGS

(Note 1)

Supply Voltage (Low Impedance Source) (V

Supply Voltage (I

Output Current ............................................................................................................. ±1A

Output Energy (Capacitive Load) ................................................................................. 5µJ

Analog Inputs (V

Error Amp Output Sink Current ............................................................................... 10mA

Power Dissipation at T

Storage Temperature Range .................................................................... -65°C to +150°C

Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C

PACKAGE PIN OUTS

Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect

to Ground. Currents are positive into, negative out of the specified terminal. Pin

numbers refer to DIL packages only.

1

8

27

36

45

M & Y PACKAGE

(Top View)

M PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

95°C/W

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

165°C/W

D PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

Y PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

130°C/W

Junction Temperature Calculation:

T

The

θ

JA

numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow

THERMAL DATA

DM PACKAGE

(Top View)

V

REF

V

CC

OUTPUT

GND

COMP

V

FB

I

SENSE

R

1

8

27

36

45

V

REF

N.C.

V

CC

V

C

OUTPUT

GND

PWR GND

COMP

N.C.

V

FB

N.C.

I

SENSE

N.C.

R

1

14

213

312

411

510

69

78

D PACKAGE

(Top View)

COMP

V

FB

I

SENSE

R

V

REF

V

CC

OUTPUT

GND