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Vishay Sfernice

Revision: 20-Feb-15

5

Document Number: 53017

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

POPULAR OPTIONS

For any option it is recommended to consult Vishay Sfernice for availability first.

Option: Enlarged Terminations

For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint

can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink

(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA

Option to order 0063: (applies to size 1206/1505/2010).

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DIMENSIONS (Option 0063) in millimeters

CASE SIZE

AB

E

D

F

MAX. TOL.

+0.152

MIN. TOL.

-0.152

MAX. TOL.

+0.127

MIN. TOL.

-0.127

MAX. TOL.

+0.13

MIN. TOL.

-0.13

MAX. TOL.

+0.13

MIN. TOL.

-0.13

NOMINAL

NOMINAL

NOMINAL

NOMINAL

NOMINAL

MIN.

MAX.

1206

3.06

1.60

0.40

1.215

0.63

0.50

0.76

1505

3.81

1.32

0.48

1.59

2010

5.08

2.54

2.215

2512

6.30

3.30

2.835

SUGGESTED LAND PATTERN (Option 0063)

CHIP SIZE

DIMENSIONS (IN MILLIMETER)

1206

3.91

0.50

1.73

1505

4.66

1.45

2010

5.93

2.67

2512

7.15

3.43

A

B

D

E

F

Enlarged

termination

Uncoatted

ceramic

Bottom view for mounting

G

min.

Z

max.

X

max.