PCAN

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Vishay Dale Thin Film

Revision: 07-Aug-14

3

Document Number: 60125

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

• Chip surface temperature measured using FLIR SC645 thermal

imaging system with an approximate test card surface

temperature of 85 °C.

•Thermal imaging was conducted under ambient conditions

resulting in a steady state test card surface temperature of 85 °C

over the full range of power levels.

• Thermal imaging and load life testing was conducted mounting

one device to a 1.6" x 3.7" test card with 3.5 mil copper plating

on both surfaces. Thermal vias on 50 mil centers were utilized for

heat transfer between surfaces of the test card.

Note

• Chip surface temperature measured using FLIR SC645 thermal

imaging system with an approximate test card surface

temperature of 85 °C.

PCAN1206 CHIP TEMP VS. APPLIED POWER

70

150

200

Chip Surface Temperature Temperature (°C)

12.0

10.0

8.0

6.0

4.0

2.0

0.0

175

Ω

30

Ω

PCAN2512 CHIP TEMP VS. APPLIED POWER

70

150

200

Chip Surface Temperature Temperature (°C)

12.0

10.0

8.0

6.0

4.0

2.0

0.0

150

Ω

30

Ω

DERATING CURVE

Ambient Temperature °C

0155

0

20

40

60

80

100

70

125