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RCVE3 Datasheet(PDF) 3 Page - Vishay Siliconix

Part # RCVE3
Description  High Voltage (up to 0.5 kV) Thick Film Chip Resistors
PDF  5 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

RCVE3 Datasheet(HTML) 3 Page - Vishay Siliconix

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RCV e3
www.vishay.com
Vishay Draloric
Revision: 27-Mar-13
3
Document Number: 20054
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (
R)
Stability for product types:
100 k
 to 10 M
RCV e3
4.5
-
Resistance
-
± 1 %
± 5 %
4.13
-
Short time
overload
U = 2.5 x
 2 x U
max.;
5 s
± (0.25 % R + 0.05
)
± (0.5 % R + 0.05
)
4.17.2
58 (Td)
Solderability
Solder bath method;
Sn60Pb40
non-activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning
(
 95 % covered);
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) °C
(3 ± 0.3) s
Good tinning
(
 95 % covered);
no visible damage
4.8.4.2
-
Temperature
coefficient
(20/- 55/20) °C and
(20/155/20) °C
± 100 ppm/K
± 200 ppm/K
4.32
21 (Uu3)
Shear (adhesion)
205 N
No visible damage
4.33
21 (Uu1)
Substrate bending
Depth 2 mm;
3 times
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05
)
4.19
14 (Na)
Rapid change of
temperature
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles
± (0.25 % R + 0.05
)
± (0.5 % R + 0.05
)
1000 cycles
± (1 % R + 0.05
)± (1 % R + 0.05 )
4.23
-
Climatic sequence:
-
± (1 % R + 0.05
)± (2 % R + 0.1 )
4.23.2
2 (Ba)
Dry heat
125 °C; 16 h
4.23.3
30 (Db)
Damp heat, cyclic
55 °C;
 90 % RH
24 h; 1 cycle
4.23.4
1 (Aa)
Cold
- 55 °C; 2 h
4.23.5
13 (M)
Low air pressure
1 kPa; (25 ± 10) °C; 1 h
4.23.6
30 (Db)
Damp heat, cyclic
55 °C; . 90 % RH
24 h; 5 cycle
4.23.7
-
DC load
U =
4.25.1
-
Endurance
at 70 °C
U =
 U
max.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (1 % R + 0.05
)± (2 % R + 0.1 )
70 °C; 8000 h
± (2 % R + 0.1
)± (4 % R + 0.1 )
4.18.2
58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
± (0.25 % R + 0.05
)
± (0.5 % R + 0.05
)
4.24
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (1 % R + 0.05
)± (2 % R + 0.05 )
4.25.3
-
Endurance at upper
category temperature
155 °C; 1000 h
± (1 % R + 0.05
)± (2 % R + 0.05 )
P
70 x R
P
70 x R
P
70 x R



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