TMP302-Q1

SLOS889B – OCTOBER 2014 – REVISED JULY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

3.6

V

Input pin voltage

TRIPSET0, TRIPSET1, HYSTSET

–0.5

V

Output pin voltage

OUT

–0.5

3.6

V

Output pin current

OUT

10

mA

Operating temperature

–55

130

°C

Junction temperature

150

°C

Storage temperature

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Power supply voltage

1.4

3.3

3.6

V

10

100

k

Ω

7.4 Thermal Information

TMP302-Q1

DRL(SOT563)

UNIT

6 PINS

Junction-to-ambient thermal resistance

200

°C/W

Junction-to-case (top) thermal resistance

73.7

°C/W

Junction-to-board thermal resistance

34.4

°C/W

Junction-to-top characterization parameter

3.1

°C/W

Junction-to-board characterization parameter

34.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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