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Material Content Data Sheet

Sales Product Name

SAK-XC2765X-104F80L AA

Issued

29. August 2013

MA#

MA001021908

Package

PG-LQFP-100-8

Weight*

755.66 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

38.601

5.11

5.11

51082

51082

leadframe

inorganic material

phosphorus

7723-14-0

0.069

0.01

91

non noble metal

zinc

7440-66-6

0.275

0.04

364

non noble metal

iron

7439-89-6

5.501

0.73

7279

non noble metal

copper

7440-50-8

223.351

29.56

30.34

295569

303303

wire

noble metal

gold

7440-57-5

2.766

0.37

0.37

3660

3660

encapsulation

organic material

carbon black

1333-86-4

2.316

0.31

3065

plastics

epoxy resin

-

62.527

8.27

82744

inorganic material

silicondioxide

60676-86-0

398.319

52.69

61.27

527113

612922

leadfinish

non noble metal

tin

7440-31-5

9.288

1.23

1.23

12292

12292

plating

noble metal

silver

7440-22-4

2.495

0.33

0.33

3302

3302

glue

plastics

epoxy resin

-

2.539

0.34

3360

noble metal

silver

7440-22-4

7.616

1.01

1.35

10079

13439

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com