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MMDF3N06HD Datasheet(PDF) 1 Page - ON Semiconductor |
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MMDF3N06HD Datasheet(HTML) 1 Page - ON Semiconductor |
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1 / 12 page ![]() © Semiconductor Components Industries, LLC, 2000 September, 2004 − Rev. XXX 1 Publication Order Number: MMDF3N06HD/D MMDF3N06HD Preferred Device Advance Information Power MOSFET 3 Amps, 60 Volts N−Channel SO−8, Dual These miniature surface mount MOSFETs feature low RDS(on) and true logic level performance. Dual MOSFET devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc−dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. • Low R DS(on) Provides Higher Efficiency and Extends Battery Life • Logic Level Gate Drive − Can Be Driven by Logic ICs • Miniature SO−8 Surface Mount Package − Saves Board Space • Diode Is Characterized for Use In Bridge Circuits • Diode Exhibits High Speed, With Soft Recovery • I DSS Specified at Elevated Temperature • Mounting Information for SO−8 Package Provided MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDSS 60 Vdc Gate−to−Source Voltage − Continuous VGS ± 20 Vdc Drain Current − Continuous @ TA = 25°C ID IDM 3.3 16.5 Adc Apk Source Current − Continuous @ TA = 25°C IS 1.7 Adc Total Power Dissipation @ TA = 25°C (Note 1.) PD 2.0 Watts Operating and Storage Temperature Range TJ, Tstg − 55 to 150 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 60 Vdc, VGS = 5.0 Vdc, VDS = 32 Vdc, IL = 15 Apk, L = 10 mH, RG = 25 Ω) EAS 105 mJ Thermal Resistance − Junction−to−Ambient RθJA 62.5 °C/W Maximum Lead Temperature for Soldering Purposes, 1/8 ″ from case for 10 seconds TL 260 °C 1. Mounted on G10/FR4 glass epoxy board using minimum recommended footprint. This document contains information on a new product. Specifications and information herein are subject to change without notice. Source−1 1 2 3 4 8 7 6 5 Top View Gate−1 Source−2 Gate−2 Drain−1 Drain−1 Drain−2 Drain−2 1 8 Device Package Shipping ORDERING INFORMATION MMDF3N06HDR2 SO−8 2500 Tape & Reel SO−8, Dual CASE 751 STYLE 11 http://onsemi.com N−Channel LYWW MARKING DIAGRAM D S G D3N06 L = Location Code Y = Year WW = Work Week PIN ASSIGNMENT 3 AMPERES 60 VOLTS RDS(on) = 100 mW Preferred devices are recommended choices for future use and best overall value. D S G |
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