If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Storage Temperature

−65˚C to +150˚C

Maximum Junction Temperature

Ceramic

+175˚C

V

−7.0V to +0.5V

Input Voltage (DC)

V

Output Current (DC Output High)

−50 mA

ESD

≥2000V

Recommended Operating

Conditions

Case Temperature

Military

−55˚C to +125˚C

Supply Voltage (V

−5.7V to −4.2V

Note 1: Absolute maximum ratings are values beyond which the device may

be damaged or have its useful life impaired. Functional operation under these

conditions is not implied.

Note 2: ESD testing conforms to MIL-STD-883, Method 3015.

Military Version

DC Electrical Characteristics

V

Symbol

Parameter

Min

Max

Units

T

C

Conditions

Notes

V

OH

Output HIGH

−1025

−870

mV

0˚C to +125˚C

V

Loading with

(Notes 3, 4, 5)

Voltage

−1085

−870

mV

−55˚C

or V

IL (min)

25

Ω to −2.0V

V

OHC

Output HIGH

−1035

mV

0˚C to +125˚C

V

or V

IL (max)

Loading with

25

Ω to −2.0V

(Notes 3, 4, 5)

Voltage

−1085

mV

−55˚C

V

OLC

Output LOW

−1610

mV

0˚C to +125˚C

Voltage

−1555

MV

−55˚C

V

OLZ

Cut-Off LOW

−1950

mV

0˚C to +125˚C

V

Loading with

(Notes 3, 4, 5)

Voltage

−1850

−55˚C

or V

IL (max)

25

Ω to −2.0V

V

IH

Input HIGH

−1165

−870

mV

−55˚C to +125˚C

Guaranteed HIGH Signal

(Notes 3, 4, 5, 6)

Voltage

for All Inputs

V

IL

Input LOW

−1830

−1475

mV

−55˚C to +125˚C

Guaranteed LOW Signal

(Notes 3, 4, 5, 6)

Voltage

for All Inputs

I

IL

Input LOW

Current

0.50

µA

−55˚C to +125˚C

V

(Notes 3, 4, 5)

I

IH

Input HIGH

240

µA

0˚C to +125˚C

V

(Notes 3, 4, 5)

Current

340

µA

−55˚C

I

EE

Power Supply

Inputs Open

Current

−155

−53

mA

−55˚C to +125˚C

V

(Notes 3, 4, 5)

Note 3: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately

without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case

condition at cold temperatures.

Note 4: Screen tested 100% on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.

Note 5: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups A1, 2, 3, 7, and 8.

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