If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Above

which the useful life may be impaired.

Storage Temperature (T

−65˚C to +150˚C

Maximum Junction Temperature (T

Ceramic

+175˚C

V

−7.0V to +0.5V

Input Voltage (DC)

V

Output Current (DC Output HIGH)

−50 mA

ESD (Note 3)

≥2000V

Recommended Operating

Conditions

Case Temperature (T

Military

−55˚C to +125˚C

Supply Voltage (V

−5.7V to −4.2V

Note 2: Absolute maximum ratings are those values beyond which the de-

vice may be damaged or have its useful life impaired. Functional operation

under these conditions is not implied.

Note 3: ESD testing conforms to MIL-STD-883, Method 3015.

Military Version

DC Electrical Characteristics

V

Symbol

Parameter

Min

Max

Units

T

C

Conditions

Notes

V

OH

Output HIGH Voltage

−1025

−870

mV

0˚C to +125˚C

−1085

−870

mV

−55˚C

V

Loading with

(Notes 4, 5,

6)

V

OL

Output LOW Voltage

−1830

−1620

mV

0˚C to +125˚C

or V

IL (Min)

50

Ω to −2.0V

−1830

−1555

mV

−55˚C

V

OHC

Output HIGH Voltage

−1035

mV

0˚C to +125˚C

−1085

mV

−55˚C

V

Loading with

(Notes 4, 5,

6)

V

OLC

Output LOW Voltage

−1610

mV

0˚C to +125˚C

or V

IL (Max)

50

Ω to −2.0V

−1555

mV

−55˚C

V

IH

Input HIGH Voltage

−1165

−870

mV

−55˚C to

Guaranteed HIGH Signal

(Notes 4, 5,

6, 7)

+125˚C

for ALL Inputs

V

IL

Input LOW Voltage

−1830

−1475

mV

−55˚C to

Guaranteed LOW Signal

(Notes 4, 5,

6, 7)

+125˚C

for ALL Inputs

I

IL

Input LOW Current

0.50

µA

−55˚C to

V

(Notes 4, 5,

6)

+125˚C

V

I

IH

Input HIGH Current

S

220

E

350

µA

0˚C to +125˚C

D

340

V

MR

430

V

(Notes 4, 5,

6)

S

320

E

500

µA

−55˚C

D

490

MR

630

I

EE

Power Supply Current

−95

−32

mA

−55˚C to +125˚C

Inputs Open

(Notes 4, 5,

6)

Note 4: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately

without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case

condition at cold temperatures.

Note 5: Screen tested 100% on each device at −55˚C, +25˚C, and +125˚C Temp., Subgroups 1, 2, 3, 7, and 8.

Note 6: Sample tested (Method 5005, Table 1) on each Mfg. lot at +25˚, +125˚C, and −55˚C Temp., Subgroups 1, 2, 3, 7, and 8.

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