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Material Content Data Sheet

Sales Product Name

IPB014N06N

Issued

29. August 2013

MA#

MA000965710

Package

PG-TO263-7-3

Weight*

1552.50 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

inorganic material

silicon

7440-21-3

26.819

1.73

1.73

17274

17274

leadframe

non noble metal

iron

7439-89-6

0.803

0.05

517

inorganic material

phosphorus

7723-14-0

0.241

0.02

155

non noble metal

copper

7440-50-8

801.714

51.65

51.72

516404

517076

wire

non noble metal

aluminium

7429-90-5

12.139

0.78

0.78

7819

7819

encapsulation

organic material

carbon black

1333-86-4

8.376

0.54

5395

plastics

epoxy resin

-

92.138

5.93

59349

inorganic material

silicondioxide

60676-86-0

457.900

29.49

35.96

294945

359689

leadfinish

non noble metal

tin

7440-31-5

12.317

0.79

0.79

7934

7934

plating

non noble metal

nickel

7440-02-0

0.269

0.02

173

inorganic material

phosphorus

7723-14-0

0.001

0.00

0.02

0

173

solder

noble metal

silver

7440-22-4

0.836

0.05

538

non noble metal

tin

7440-31-5

0.669

0.04

431

non noble metal

lead

7439-92-1

31.925

2.06

2.15

20564

21533

heatspreader

inorganic material

phosphorus

7723-14-0

0.032

0.00

21

non noble metal

iron

7439-89-6

0.106

0.01

69

non noble metal

copper

7440-50-8

106.210

6.84

6.85

68412

68502

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com