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F2923 Datasheet(PDF) 2 Page - Integrated Device Technology

Part # F2923
Description  Constant Impedance Kz SP2T RF Switch
PDF  21 Pages
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

F2923 Datasheet(HTML) 2 Page - Integrated Device Technology

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F2923
Constant Impedance Absorptive SP2T RF Switch
2
Rev O 11/9/2015
ABSOLUTE MAXIMUM RATINGS
Parameter / Condition
Symbol
Min
Max
Unit
Vcc to GND
Vcc
-0.3
+3.9
V
CTL1, CTL2
VCNTL
-0.3
Vcc + 0.3
V
ModeCTL to GND
VMODE
-0.3
Vcc + 0.3
V
RF1, RF2, RF_COM
VRF
-0.3
+0.3
V
Maximum Junction Temperature
TJmax
+140
°C
Storage Temperature Range
TST
-65
+150
°C
Lead Temperature (soldering, 10s)
TLEAD
+260
°C
ESD Voltage– HBM (Per JESD22-A114)
VESDHBM
Class 2
ESD Voltage – CDM (Per JESD22-C101)
VESDCDM
Class III
ABS MAX RF POWER AT 2 GHZ WITH TC = +85 °C *
RF1, RF2, RF_COM (RF1 or RF2 is connected to RF_COM, IL States)
+33dBm
RF1, RF2, RF_COM (When port is internally terminated)
+24dBm
ABS MAX RF POWER AT 2 GHZ WITH TC = +105 °C *
RF1, RF2, RF_COM (RF1 or RF2 is connected to RF_COM, IL States)
+33dBm
RF1, RF2, RF_COM (When port is internally terminated)
+21dBm
* Temperature of exposed paddle
Stresses above those listed above may cause permanent damage to the device. Functional operation of the device at
these or any other conditions above those indicated in the operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL AND MOISTURE CHARACTERISTICS
θJA (Junction – Ambient)
60 °C/W
θJC (Junction – Case) The Case is defined as the exposed paddle
3.9 °C/W
Moisture Sensitivity Rating (Per J-STD-020)
MSL1



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