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Material Content Data Sheet

Sales Product Name

ESD112-B1-02ELS E6327

Issued

29. August 2013

MA#

MA001085708

Package

PG-TSSLP-2-4

Weight*

0.21 mg

Construction Element

Material Group

Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip

non noble metal

tin

7440-31-5

0.001

0.33

3262

noble metal

gold

7440-57-5

0.003

1.27

12661

inorganic material

silicon

7440-21-3

0.020

9.38

10.98

93810

109733

leadframe

non noble metal

nickel

7440-02-0

0.108

50.59

50.59

505908

505908

wire

noble metal

gold

7440-57-5

0.003

1.47

1.47

14748

14748

encapsulation

organic material

carbon black

1333-86-4

0.000

0.16

1633

plastics

epoxy resin

-

0.010

4.74

47432

inorganic material

silicondioxide

60676-86-0

0.059

27.80

32.70

278047

327112

leadfinish

noble metal

gold

7440-57-5

0.004

1.73

1.73

17262

17262

plating

noble metal

palladium

7440-05-3

0.001

0.60

5986

noble metal

gold

7440-57-5

0.004

1.93

2.53

19251

25237

*deviation

< 10%

Sum in total:

100,00

1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company

Infineon Technologies AG

Address

81726 München

Internet

www.infineon.com