MIS2DH datasheet(20/49 Pages) STMICROELECTRONICS

20 / 49 page

Application hints

MIS2DH

20/49

DocID027506 Rev 2

Application hints

Figure 5. MIS2DH electrical connections

The device core is supplied through the Vdd line while the I/O pads are supplied through the

Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 μF aluminum) should

be placed as near as possible to pin 9 of the device (common design practice).

All the voltage and ground supplies must be present at the same time to have proper

behavior of the IC (refer to Figure 5). It is possible to remove Vdd while maintaining Vdd_IO

without blocking the communication bus, in this condition the measurement chain is

powered off.

The functionality of the device and the measured acceleration data is selectable and

accessible through the I2C or SPI interfaces. When using the I2C, CS must be tied high.

The functions, the threshold and the timing of the two interrupt pins (INT1 and INT2) can be

completely programmed by the user through the I2C/SPI interface.

3.1

Soldering information

The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.

It is qualified for soldering heat resistance according to JEDEC J-STD-020.

Leave “Pin 1 Indicator” unconnected during soldering.

Land pattern and soldering recommendations are available at www.st.com.

MIS2DH Datasheet(PDF) 20 Page - STMicroelectronics