REF2025, REF2030, REF2033, REF2041

SBOS600B – MAY 2014 – REVISED JULY 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

6

V

Input voltage

EN

–0.3

V

Operating temperature range

–55

150

°C

Temperature

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

170

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–4000

4000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

–1500

1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

(1)

5.5

V

(1)

Please refer to Figure 28 in Typical Characteristics for minimum input voltage at different load currents and temperature

7.4 Thermal Information

REF20xx

DDC (SOT23)

UNIT

5 PINS

Junction-to-ambient thermal resistance

193.6

Junction-to-case (top) thermal resistance

40.2

Junction-to-board thermal resistance

34.5

°C/W

Junction-to-top characterization parameter

0.9

Junction-to-board characterization parameter

34.3

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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