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ams Datasheet

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[v1-01] 2015-May-22

AS1383 − Absolute Maximum R atings

Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. These are stress

ratings only. Functional operation of the device at these or any

other conditions beyond those indicated under Electrical

Characteristics is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

Figure 6:

Absolute Maximum Ratings

Note(s) and/or Footnote(s):

1. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

All pins to GND

-0.3

+ 0.3

V

Input Current

(latch-up immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

±2

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Operating Temperature

-40

85

°C

Thermal Resistance

110

°C/W

Junction Temperature

150

°C

Storage Temperature Range

-55

125

°C

Package Body Temperature

260

°C

Norm IPC/JEDEC J-STD-020 (1)

Relative Humidity

non-condensing

585

%

MSL

Moisture Sensitivity Level

1

Represents an unlimited floor life

time

Absolute Maximum Ratings