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13005

Rev. 1.2

1 of 1

CUSTOMIZATION: ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION.

SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE

FURNISHED, DEPENDING ON QUANTITY.

ARIES RESERVES THE RIGHT TO CHANGE PRODUCT GENERAL SPECIFICATIONS

WITHOUT NOTICE

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE

CONSIDERED UNCONTROLLED

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

FOR VERTICAL MOUNTING, SEE DATA SHEET 13002

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

w/Collet Contacts for Horizontal Mounting

FEATURES

• DIPPackagingofLEDs,IncandescentLamps,DIPSwitches,TestPoints,etc.

• VariationsofMountingPositionsprovideExceptionalDesignFreedom

• AcceptsStandardLEDsandIncandescentDisplaysaswellas0.500[21.70]and0.600[15.24]

TallDisplays

GENERAL SPECIFICATIONS

•

STANDARD BODY MATERIAL:blackUL94V-0glass-filled4/6Nylon

•

SPACER:fishpaper(socketswith“X”0.300[7.62]only)

•

PIN BODY:Brass3601/2-hardperUNSC36000ASTMB16/B16M-05

•

PIN BODY PLATING:200µ[5.07µ]min.93/7Sn/PbperASTMB545–OR– 200µ

[5.07µ]SnperASTMB545Type1over100µ[2.54µ]min.NiperSAEAMS-QQ-N-

290B

•

4-FINGER COLLET CONTACT:BeCuperUNSC17200ASTMB194-08

•

CONTACT PLATING:30µ[0.76µ]min.AuperMIL-G-45204over50µ[1.27µ]min.Ni

perSAEAMS-QQ-N-290B

•

ACCEPTS LEADS:0.015-0.025[0.38-0.64]dia.,0.110-0.150[2.79-3.81]long

•

CONTACT CURRENT RATING:3amps

•

OPERATING TEMPERATURE:-67°Fto221°F[-55°Cto105°C]

•

INSERTION FORCE:180g/pin,basedon0.018[0.46]dia.testlead

•

WITHDRAWAL FORCE:90g/pin,basedon0.018[0.46]dia.testlead

•

NORMAL FORCE:140g/pin,basedon0.018[0.46]dia.testlead

MOUNTING CONSIDERATIONS

•

SUGGESTED PCB HOLE SIZE:0.035±0.002[0.89±0.05]dia.

Centers “C”

Dim. “D”

Body Style Available Sizes

0.200[5.08]

0.300[7.62]

A

6thru10

C

6thru20

0.300[7.62]

0.400[10.16]

B

22thru40

0.400[10.16] 0.500[12.70]

C

6thru22

0.600[15.24] 0.700[17.78]

C

6thru40

B

42thru48

ORDERING INFORMATION

XX-X82 X-90C TL

Optional Pin Body Plating

TL=Sn/Pb

Display Angle

PCB Footprint,Dim.“X”

0=0.100[2.54]

2=0.200[5.08]

3=0.300[7.62]

Device Footprint,Dim.“C”

282=0.200[5.08]

82=0.300[7.62]

482=0.400[10.16]

682=0.600[15.24]

Pin Count & Spacing,Dim.“C”

(SeeTable)