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Würth Elektronik eiSos GmbH & Co. KG - Data Sheet - REV 1.0

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WPMDH1152401 / 171012402

VDRM - Variable Step Down Regulator Module

DESIGN FLOW

4: Make input and output bus connections as wide as possible.

This reduces any voltage drops on the input or output of the converter and maximizes efficiency.

5: Provide adequate device heat-sinking.

Use an array of heat-sinking vias to connect the exposed pad to the ground plane on the bottom PCB layer. If the

PCB has a plurality of copper layers, these thermal vias can also be used to make connection to inner layer heat-

spreading ground planes. For best results use a 6 x 6 via array with minimum via diameter of 254

μm thermal vias

spaced 1.5mm. Ensure enough copper area is used for heat-sinking to keep the junction temperature below 125°C.