ADP2389ACPZ-R7 datasheet(6/23 Pages) AD

6 / 23 page

ADP2389/ADP2390

Data Sheet

Rev. 0 | Page 6 of 23

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

PVIN, VIN, EN, PGOOD

−0.3 V to +22 V

−1 V to +22 V

BST

VSW + 6 V

FB, SS, COMP, RT, ILIM, FTW, VREG

−0.3 V to +6 V

PGND to GND

−0.3 V to +0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Unless otherwise specified, all other voltages are referenced to

GND.

THERMAL INFORMATION

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board (4-layer, JEDEC standard board) for

surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

32-Lead LFCSP

2.2

°C/W

ESD CAUTION

ADP2389ACPZ-R7 Datasheet(PDF) 6 Page - Analog Devices

ADP2389ACPZ-R7 Datasheet(HTML) 6 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

Datasheet Download

Link URL