3

ASB110 Series

www.xppower.com

AC-DC Power Supplies

Optional Heatsink (IFH HEATSINK)

Application Notes

0.23

(5.9)

0.67

(17.0)

2.40

(61.0)

ACL

+Vout

-Vout

ACN

FG

0.40

(10.16)

0.40

(10.16)

4.20 (106.7)

4.60 (116.8)

4 mounting holes, 3.5 mm

5-Ø 0.08

(2.0)

2.00

(50.8)

1. Dimensions shown in inches (mm).

2. Weight: 0.51 lb (230 g)

3. Pin diameter: 0.04 ±0.002 (1.0 ±0.05)

4. Pin pitch tolerance: ±0.014 (±0.35)

5. Case tolerance: ±0.02 (±0.5)

6. Baseplate is connected to FG Pin

Notes

Mechanical Details

4.60 (116.8)

2.40

(61.0)

1.00

(25.4)

4.20 (106.7)

100

50

0

-40 -30 -20

-10

0

10

20

Ambient Temperature (°C)

30

40

50

60

70

80

90

With IFH HEATSINK

100

50

0

-40 -30 -20

-10

0

10

20

Baseplate Temperature (°C)

30

40

50

60

70

80

90

Derating Curve

When ASB110 is fitted with IFH HEATSINK and mounted in horizontal position with heatsink upper most, the base plate temperature will typically be 85 °C in an ambient

of 50 °C.

Notes