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24LCS52 Datasheet(PDF) 33 Page - Microchip Technology

Part # 24LCS52
Description  EEPROM with Software Write-Protect
PDF  36 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

24LCS52 Datasheet(HTML) 33 Page - Microchip Technology

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 1996-2011 Microchip Technology Inc.
DS21166K-page33
24AA52/24LCS52
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Package
Temperature
Range
Device
Device:
24AA52:
= 1.8V, 2 Kbit I2C Serial EEPROM
24AA52T: = 1.8V, 2 Kbit I2C Serial EEPROM
(Tape and Reel)
24LCS52: = 2.2V, 2 Kbit I2C Serial EEPROM
24LCS52T: = 2.2V, 2 Kbit I2C Serial EEPROM
(Tape and Reel)
Temperature
Range:
I
=
-40°C to +85°C
Package:
P
=
Plastic DIP (300 mil body), 8-lead
SN
=
Plastic SOIC (150 mil body), 8-lead
ST
=
Plastic TSSOP (4.4 mm), 8-lead
MS
=
Plastic Micro Small Outline (MSOP), 8-lead
MC
=
Micro Lead Frame (2x3 mm body), 8-lead
MNY(1)=
TDFN (2x3x0.75 mm body), 8-lead (Tape
and Reel only)
Note 1: "Y" indicates a Nickel Palladium Gold (NiPdAu) finish.
Examples:
a)
24AA52-I/P:
Industrial
Temperature,
1.8V, PDIP package
b)
24AA52-I/SN: Industrial Temperature,
1.8V, SOIC package
c)
24AA52T-I/MS: Tape and Reel, Industrial
Temperature, 1.8V, MSOP package
d)
24LCS52-I/P: Industrial Temperature,
2.2V, PDIP package
e)
24LCS52-I/MC: Industrial Temperature,
2.2V, DFN package
f)
24LCS52T-I/MS:
Tape
and
Reel,
Industrial Temperature, 2.2V, MSOP
package
g)
24LCS52T-I/MNY: Tape and Reel, Indus-
trial Temperature, 2.2V, TDFN package
X
Lead Finish



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