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LAN9730 Datasheet(PDF) 214 Page - Microchip Technology |
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LAN9730 Datasheet(HTML) 214 Page - Microchip Technology |
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214 / 222 page ![]() LAN9730/LAN9730i DS00001946A-page 214 2012-2015 Microchip Technology Inc. Microchip Technology Drawing C04-375A Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Terminal Length Mold Cap Thickness Pitch Standoff Units Dimension Limits A1 A b A2 e L N 0.50 BSC 0.30 0.18 0.70 0.00 0.23 0.40 0.85 0.02 MILLIMETERS MIN NOM 56 0.50 0.30 1.00 0.05 MAX K- 0.20 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is punch singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Overall Width Overall Length Exposed Pad Width Exposed Pad Length D E2 D2 E 5.80 8.00 BSC 5.90 8.00 BSC 6.00 D1 E1 Molded Top Width Molded Top Length 7.65 7.65 7.75 7.75 7.85 7.85 - - 0.90 5.80 5.90 6.00 56L Very Thin Quad Flat, No Lead Package (RT) - 8x8 mm Body [VQFN] With 5.9x5.9 mm Exposed Pad; Punch Singulated |
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