BSP123 datasheet(2/8 Pages) INFINEON

2 / 8 page

2003-02-26

Page 2

Rev. 1.0

BSP123

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - soldering point

(Pin 4)

RthJS

K/W

SMD version, device on PCB:

@ min. footprint

@ 6 cm2 cooling area 1)

RthJA

100

115

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain-source breakdown voltage

VGS=0, ID=250µA

V(BR)DSS

100

Gate threshold voltage, VGS = VDS

ID=50µA

VGS(th)

0.8

1.4

1.8

Zero gate voltage drain current

VDS=100V, VGS=0, Tj=25°C

VDS=100V, VGS=0, Tj=150°C

IDSS

0.01

µA

Gate-source leakage current

VGS=20V, VDS=0

IGSS

Drain-source on-state resistance

VGS=2.8V, ID=15mA

RDS(on)

Ω

Drain-source on-state resistance

VGS=4.5V, ID=0.3A

RDS(on)

4.8

Drain-source on-state resistance

VGS=10V, ID=0.37A

RDS(on)

3.5

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (single layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.

BSP123 Datasheet(PDF) 2 Page - Infineon Technologies AG

BSP123 Datasheet(HTML) 2 Page - Infineon Technologies AG

Html Pages

1 2 3 4 5 6 7 8

Datasheet Download

Link URL