USB3300 datasheet(44/53 Pages) MICROCHIP

44 / 53 page

USB3300

DS00001783B-page 44

 2014-2015 Microchip Technology Inc.

7.4.2

IEC61000-4-2 PERFORMANCE

The IEC61000-4-2 ESD specification is an international standard that addresses system-level immunity to ESD strikes

while the end equipment is operational. In contrast, the HBM ESD tests are performed at the device level with the device

powered down.

Microchip contracts with independent laboratories to test the USB3300 to IEC61000-4-2 in a working system. Reports

are available upon request. Please contact your Microchip representative, and request information on 3rd party ESD

test results. The reports show that systems designed with the USB3300 can safely dissipate ±15kV air discharges and

±8kV contact discharges per the IEC61000-4-2 specification without additional board level protection.

Both air discharge and contact discharge test techniques for applying stress conditions are defined by the IEC61000-4-

2 ESD document.

7.4.2.1

Air Discharge

To perform this test, a charged electrode is moved close to the system being tested until a spark is generated. This test

is difficult to reproduce because the discharge is influenced by such factors as humidity, the speed of approach of the

electrode, and construction of the test equipment.

7.4.2.2

Contact Discharge

The uncharged electrode first contacts the pin to prepare this test, and then the probe tip is energized. This yields more

repeatable results, and is the preferred test method. The independent test laboratories contracted by Microchip provide

test results for both types of discharge methods.

USB3300 Datasheet(PDF) 44 Page - Microchip Technology