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L6362A Datasheet(PDF) 11 Page - STMicroelectronics |
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L6362A Datasheet(HTML) 11 Page - STMicroelectronics |
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11 / 37 page ![]() L6362A Absolute maximum ratings DocID027660 Rev 4 11/37 Table 5: Thermal data Symbol Parameter Value Unit Rth(JC) Thermal resistance junction-case 2.5 °C/W Rth(JA) Thermal resistance junction-ambient. (FR4, Cu thick. 35 µm, 2 layers, the exposed pad is not soldered to total exposed area = 5 mm2) 200 Thermal resistance junction-ambient. (FR4, Cu thick. 35 µm, 2 layers, the exposed pad is soldered to total exposed area = 5 mm2) 100 Thermal resistance junction-ambient. (FR4, Cu thick. 35 µm, 2 layers, the exposed pad has to be soldered to total exposed area = 100 mm2 with vias ) 50 |
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