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BSS87 Datasheet(PDF) 2 Page - Infineon Technologies AG |
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BSS87 Datasheet(HTML) 2 Page - Infineon Technologies AG |
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2 / 8 page ![]() 2002-11-14 Page 2 BSS87 Rev. 1.0 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - case (Pin 2) RthJC - - 10 K/W SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 1) RthJA - - - - 125 70 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain-source breakdown voltage VGS=0, ID=250µA V(BR)DSS 240 - - V Gate threshold voltage, VGS = VDS ID=108µA VGS(th) 0.8 1.2 1.8 Zero gate voltage drain current VDS=240V, VGS=0, Tj=25°C VDS=240V, VGS=0, Tj=150°C IDSS - - - - 0.1 100 µA Gate-source leakage current VGS=20V, VDS=0 IGSS - - 10 nA Drain-source on-state resistance VGS=4.5V, ID=0.24A RDS(on) - 4.6 7.5 W Drain-source on-state resistance VGS=10V, ID=0.26A RDS(on) - 3.9 6 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. |
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