DocID026965 Rev 2

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ALED6001

Absolute maximum ratings

26

4

Absolute maximum ratings

1.

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or any other condition above those indicated in Table 5 is not implied. Exposure to absolute

maximum rated conditions for extended periods may affect device reliability.

Parameter

Pin

Min.

Max.

Unit

Maximum pin voltage

VIN to SGND

40

V

VFBP and VFBN to SGND

65

VDR to SGND

-0.3

6

LDO3 to SGND

-0.3

3.6

COMP, CSNS and OVFB to SGND

-0.3

3.6

PGND to SGND

-0.3

0.3

XFAULT, FSW, ADIM and GATE to SGND

-0.3

6

PWMI and PWMO to SGND

-0.3

6

HBM ESD susceptibility

JEDEC JS001

All pins

-2000

2000

VIN, VFBP, VFBN and ADIM ESD

susceptibility

VIN, VFBP, VFBN, ADIM to SGND

-4000

4000

CDM ESD resistivity to SGND

ANSI/ESD STM5.3.1

Corner pins

-750

750

Non-corner pins

-500

500

Table 4. Thermal characteristics

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

Operating junction temperature

-40

150

°C

Storage temperature range

-50

150

Thermal shutdown threshold

150

160

175

Thermal shutdown hysteresis

20

XFAULT release hysteresis

40

(1)

Junction to ambient thermal resistance

1s0p

55

°C/W

2s2p

45

Junction to case thermal resistance

37

1.

The device mounted on a standard JESD51-5 test board.