478

478

Reference for Manual Soldering

Example of Reflow Soldering Condition

Reference for Dip Soldering

I max.

H max.

300

200

100

Room

temperature

Pre-heating

E max.

Time（s）

A

B

C

D

F max.

G max.

Series

Tip temperature

Soldering time

RDC50, RDC90, RDC80

350±5℃

3 s

RDC10, RD7

350℃ max.

3s max.

Series

Preheating

Dip soldering

No. of solders

Soldering surface

temperature

Heating time

Soldering

temperature

Soldering time

RDC501, RDC502

100 to 150℃

1minute max.

260±5℃

10±1s

1 time

RD7

100℃ max.

1minute max.

260℃ max.

5s max.

1 time

+1

0

1. Cleaning Cleaning should not be attempted.

2. Type of solder to be used Use cream solder that contains 10 to 15 %wt flux.

3. Number of solder applications - apply solder only once

4. Recommended reflow conditions

1. When using an infrared reflow oven, solder may not always be applied as intended.

Be sure to use a hot air reflow oven or a type that uses infrared rays in combination with hot air.

2. The temperatures given above are the maximum temperatures at the terminals of the sensor when employing a hot air

　 reflow method. The temperature of the PC board and the surface temperature of the sensor may vary greatly depending

　on the PC board material, its size and thickness. Ensure that the surface temperature of the sensor does not rise to 250℃

　 or greater.

3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.

Notes

Resistive Position Sensors / Soldering Conditions

Series

A

B

C

D

E

F

G

H

I

No. of

reflows

RDC503

RDC506

250℃

230℃

180℃

150℃

2min.

ー

5s

40s

4min.

1 time

RDC90

255℃

230℃

ー

ー

ー

2min.

10s

1min.

4min.

1 time

RDC80

250℃

ー

180℃

150℃

90±30s

ー

10±1s

ー

ー

1 time