Package information

USBULC6-2F7

6/9

DocID025264 Rev 1

3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 17. Package dimensions

Figure 18. Footprint recommendations

Figure 19. Marking

170 µm ± 20

0.73 mm ± 30 µm

230 µm ± 25

350 µm ± 10

375 µm ± 40

190 µm

Circle 250 µm

200 µm

Solder stencil opening :

Copper pad Diameter:

Solder mask opening: 300 µm

Dot

xx = marking

yww = datecode

(y = year

ww = week)

z = additional information

x

y

x

w

z

w