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54F245DM Datasheet(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # 54F245DM
Description  Octal Bidirectional Transceiver with TRI-STATE Outputs
PDF  8 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

54F245DM Datasheet(HTML) 4 Page - National Semiconductor (TI)

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DC Electrical Characteristics (Continued)
Symbol
Parameter
54F74F
Units
VCC
Conditions
Min
Typ
Max
IOS
Output Short-Circuit Current
b
60
b
150
mA
Max
VOUT e 0V (An)
b
100
b
225
VOUT e 0V (Bn)
IZZ
Bus Drainage Test
500
m
A
00V
VOUT e 525V(An Bn)
ICCH
Power Supply Current
70
90
mA
Max
VO e HIGH
ICCL
Power Supply Current
95
120
mA
Max
VO e LOW
ICCZ
Power Supply Current
85
110
mA
Max
VO e HIGH Z
AC Electrical Characteristics
74F
54F
74F
TA ea25 C
TA VCC e Mil
TA VCC e Com
Symbol
Parameter
VCC ea50V
CL e 50 pF
CL e 50 pF
Units
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
tPLH
Propagation Delay
25
42
60
20
75
20
70
ns
tPHL
An to Bn or Bn to An
25
42
60
20
75
20
70
tPZH
Output Enable Time
30
53
70
25
90
25
80
tPZL
35
60
80
30
100
30
90
ns
tPHZ
Output Disable Time
20
50
65
20
90
20
75
tPLZ
20
50
65
20
100
20
75
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
245
S
C
X
Temperature Range Family
Special Variations
74F e Commercial
QB e Military grade device with
54F e Military
environmental and burn-in
processing
Device Type
X e Devices shipped in 13 reel
Package Code
Temperature Range
P e Plastic DIP
C e Commercial (0 Cto a70 C)
D e Ceramic DIP
M e Military (b55 Cto a125 C)
F e Flatpak
L e Leadless Chip Carrier (LCC)
NOTE NOT REQUIRED
S e Small Outline SOIC JEDEC
FOR MSA PACKAGE CODE
MSA e Shrink Small Outline Package (EIAJ SSOP)
SJ e Small Outline Package SOIC EIAJ
4



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