SPP07N60C2 datasheet(2/14 Pages) INFINEON

2 / 14 page

2002-08-12

Page 2

SPP07N60C2, SPB07N60C2

SPA07N60C2

Final data

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - case

RthJC

1.5

K/W

Thremal resistance, junction - case, FullPAK

RthJC_FP

3.9

Thermal resistance, junction - ambient, leaded

RthJA

Thermal resistance, junction - ambient, FullPAK

RthJA_FP

SMD version, device on PCB:

@ min. footprint

@ 6 cm2 cooling area 3)

RthJA

Linear derating factor

0.66

W/K

Linear derating factor, FullPAK

0.25

Soldering temperature,

1.6 mm (0.063 in.) from case for 10s

Tsold

260

°C

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified

Static Characteristics

Drain-source breakdown voltage

VGS=0V, ID=0.25mA

V(BR)DSS

600

Drain-source avalanche breakdown voltage

VGS=0V, ID=7.3A

V(BR)DS

700

Gate threshold voltage, VGS = VDS

ID=350µA

VGS(th)

3.5

4.5

5.5

Zero gate voltage drain current

VDS = 600 V, VGS = 0 V, Tj = 25 °C

VDS = 600 V, VGS = 0 V, Tj = 150 °C

IDSS

0.1

100

µA

Gate-source leakage current

VGS=20V, VDS=0V

IGSS

100

Drain-source on-state resistance

VGS=10V, ID=4.6A, Tj=25°C

RDS(on)

0.54

0.6

Ω

Gate input resistance

f = 1 MHz, open drain

0.8

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