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RF2870
Rev A8 030507
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
0.50 (mm) Typ.
1.50 (mm)
Typ.
0.50 (mm) Typ.
Pin 16
A
A
A
A
C
B
B
B
B
A
A
A
A
B
B
B
B
Pin 1
Pin 8
Pin 12
0.60 (mm) Typ.
0.60 (mm) Typ.
0.75 (mm) Typ.
1.50 (mm)
Typ.
0.75 (mm)
Typ.
A = 0.38 x 0.79 (mm) Typ.
B = 0.79 x 0.38 (mm) Typ.
C = 1.70 (mm) Sq.
Figure 2. PCB Solder Mask Pattern (Top View)
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