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MCP25612FD Datasheet(PDF) 11 Page - Microchip Technology

Part # MCP25612FD
Description  Dual CAN Flexible Data-Rate Transceiver
PDF  26 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP25612FD Datasheet(HTML) 11 Page - Microchip Technology

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 2015 Microchip Technology Inc.
DS20005409A-page 11
MCP25612FD
2.3
Terms and Definitions
A number of terms are defined in ISO-11898 that are
used to describe the electrical characteristics of a CAN
transceiver device. These terms and definitions are
summarized in this section.
2.3.1
BUS VOLTAGE
VCANLX and VCANHX denote the voltages of the bus line
wires, CANLx and CANHx, relative to the ground of
each individual CAN node.
2.3.2
COMMON-MODE BUS VOLTAGE
RANGE
Boundary voltage levels of VCANLX and VCANHX, with
respect to ground, for which proper operation will occur
if up to the maximum number of CAN nodes are
connected to the bus.
2.3.3
DIFFERENTIAL INTERNAL
CAPACITANCE, CDIFF
(OF A CAN NODE)
Capacitance seen between CANLx and CANHx
during the Recessive state, when the CAN node is
disconnected from the bus (see Figure 2-6).
2.3.4
DIFFERENTIAL INTERNAL
RESISTANCE, RDIFF
(OF A CAN NODE)
Resistance seen between CANLx and CANHx, during
the Recessive state, when the CAN node is
disconnected from the bus (see Figure 2-6).
2.3.5
DIFFERENTIAL VOLTAGE, VDIFFX
(OF CAN BUS)
Differential voltage of the two-wire CAN bus value:
VDIFFX =VCANHX –VCANLX.
2.3.6
INTERNAL CAPACITANCE, CIN
(OF A CAN NODE)
Capacitance seen between CANLx (or CANHx) and
ground, during the Recessive state, when the CAN
node is disconnected from the bus (see Figure 2-6).
2.3.7
INTERNAL RESISTANCE, RIN
(OF A CAN NODE)
Resistance seen between CANLx (or CANHx) and
ground, during the Recessive state, when the CAN
node is disconnected from the bus (see Figure 2-6).
FIGURE 2-6:
Physical Layer Definitions.
RIN
RIN
RDIFF
CIN
CIN
CDIFF
CANLx
CANHx
GROUND
ECU



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