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STR3A455 Datasheet(PDF) 21 Page - Sanken electric |
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STR3A455 Datasheet(HTML) 21 Page - Sanken electric |
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21 / 26 page ![]() STR3A400 Series STR3A400-DSE Rev.2.1 SANKEN ELECTRIC CO.,LTD. 21 Sept. 18, 2015 http://www.sanken-ele.co.jp/en/ © SANKEN ELECTRIC CO.,LTD. 2014 (7) Thermal Considerations Because the power MOSFET has a positive thermal coefficient of RDS(ON), consider it in thermal design. Since the copper area under the IC and the D/ST pin trace act as a heatsink, its traces should be as wide as possible. C1 C5 R1 D1 D2 R2 C2 T1 C51 D P S PC1 C3 ROCP C4 1 2 3 4 D/ST VCC NC S/OCP FB/OLP GND 8 7 5 STR3A400 U1 A DST CY D51 (1) Main trace should be wide trace and small loop (6) Main trace of secondary side should be wide trace and small loop (7)Trace of D/ST pin should be wide for heat release (2) Control GND trace should be connected at a single point as close to the ROCP as possible (3) Loop of the power supply should be small (4)ROCP Should be as close to S/OCP pin as possible. (5)The components connected to FB/OLP pin should be as close to FB/OLP pin as possible 6 D/ST D/ST D/ST Figure 10-5 Peripheral circuit example around the IC |
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