Bristol, PA 19007-6810 USA

TEL (215) 781-9956 • FAX (215) 781-9845

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• INFO@ARIESELEC.COM

WWW.ARIESELEC.COM

FEATURES

• Convert surface-mount QFP packages to a 13x13 PGA footprint.

• Reduce costs by using less-expensive QFP packages to replace PGA footprints in

existing designs.

• Pins are mechanically fastened and soldered to board using Aries’ patented process,

creating a reliable electrical connection and rugged contact.

• Consult factory for Panelized Form or for mounting of consigned chips.

GENERAL SPECIFICATIONS

• ADAPTOR BODY: FR-4 with 1-oz. Cu traces

• PADS: finished with ENIG (Immersion Au over Electroless Ni) to eliminate copla-

narity concerns and solder bridges associated with hot air solder leveling

• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ]

Ni per SAE AMS-QQ-N-290

• OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.

• Will Plug into standard PGA socket

18021

Rev. AB

P/N 97-56001 Motorola DSP56000/001

QFP-to-PGA Adapter

ORDERING INFORMATION

P/N 97-56001 QFP-to-PGA 13x13 Adapter

P/N 97-56001-P QFP-to-PGA 13x13

Panelized Form

P/N 100-PGM13069-30 QFP-to-PGA 13x13

Wire Wrap

CUSTOMIZATION: In addition to the standard products shown

on this page, Aries specializes in custom design and production.

Special materials, platings, sizes, and configurations can be

furnished, depending on the quantity.

NOTE: Aries reserves the

right to change product general specifications without notice.

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

ROW-TO-ROW ±0.003 [±0.08]

PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS