TPS62590

SLVS897C – JANUARY 2009 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

7

Voltage at EN, MODE

–0.3

V

Voltage on SW

–0.3

7

Peak output current

Internally limited

A

Maximum operating junction temperature

–40

125

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

2.5

5.5

V

Output voltage for adjustable voltage

0.75

V

Operating ambient temperature

–40

85

°C

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS62590

DRV (WSON)

UNIT

6 PINS

Junction-to-ambient thermal resistance

67.8

°C/W

Junction-to-case (top) thermal resistance

88.5

°C/W

Junction-to-board thermal resistance

37.2

°C/W

Junction-to-top characterization parameter

2.0

°C/W

Junction-to-board characterization parameter

37.6

°C/W

Junction-to-case (bottom) thermal resistance

7.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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