Bristol, PA 19007-6810 USA

TEL (215) 781-9956 • FAX (215) 781-9845

PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED

• INFO@ARIESELEC.COM

WWW.ARIESELEC.COM

FEATURES

• Allows placing an PLCC package on a board laid out for a shrink DIP.

GENERAL SPECIFICATIONS

• BOARD MATERIAL: 0.062 [1.58] thick FR-4 with 1-oz. Cu traces, both sides

• PADS: HASL

• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

• PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE

AMS-QQ-N-290

• OPERATING TEMPERATURE: 221°F [105°C]

• FEMALE SOCKET: AMP or equivalent standard single beam PLCC socket

MOUNTING CONSIDERATIONS

• Solder process like any other surface mount device

18052

Rev. AA

5-Pin PLCC Motorola

MC68HC11E9-to-56-Pin SDIP Adapter

PLCC

SDIP

PLCC

SDIP

1

1

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29

2

2

27

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3

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31

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7

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8

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9

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10

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CUSTOMIZATION: In addition to the standard products shown

on this page, Aries specializes in custom design and production.

Special materials, platings, sizes, and configurations can be

furnished, depending on the quantity.

NOTE: Aries reserves the

right to change product general specifications without notice.

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

ORDERING INFORMATION

1109252-P

Optional Panelized Form