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24014

2 of 3

Rev. 1.2

CSP Test Socket for Optical Laser Failure Analysis

w/Emission Microscopy*

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

CONSULT FACTORY for DIM. “A” - “K”

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materi-

als, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general

specifications without notice.

* Emission Microscopy (EMMI) is a powerful early-stage noninvasive failure analysis technique localizing failures and requiring little

sample preparation. Flip-chip devices, difficult to study by other means, are easily studied through the die without decapsu-

lation and often without thinning, making it an efficient optical analysis technique that will detect and localize certain integrated

circuit failures. It can be performed from either the front or back sides of devices.

FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE

PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.