MICROWAVE CORPORATION

7 - 17

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

7

HMC322

GaAs MMIC SP8T NON-REFLECTIVE

SWITCH, DC - 10.0 GHz

v00.0303

Outline Drawing

NOTES:

1. DIMENSIONS IN INCHES [MILLIMETERS].

2. DIE THICKNESS IS 0.004”.

3. TYPICAL BOND PAD IS 0.004” SQUARE.

4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER.

5. BOND PAD METALLIZATION: GOLD.

6. BACKSIDE METALLIZATION: GOLD.

7. BACKSIDE METAL IS GROUND.

8. NO CONNECTION REQUIRED FOR UNLABELED GROUND BOND PADS.