MICROWAVE CORPORATION

5 - 99

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5

Pad Number

Function

Description

Interface Schematic

1

Vdd

Power supply for the LO Amplifier. An external RF bypass

capacitor of 100 - 330 pF is required. A MIM border capacitor is

recommended. The bond length to the capacitor should be as

short as possible. The ground side of the capacitor should be

connected to the housing ground.

2

RF Port

RF Port. This pad is AC coupled and matched to 50 Ohm from

15 - 30 GHz.

3

IF Port

IF Port. This pad is DC coupled and should be DC blocked

externally using a series capacitor whose value has been

chosen to pass the necessary IF frequency range. Any applied

DC voltage to this pin will result in die non-function and possible

die failure.

4

LO Port

LO Port. This pad is AC coupled and matched to 50 ohm from

8 - 12 GHz

Outline Drawing

HMC337

GaAs MMIC SUB-HARMONICALLY

PUMPED MIXER, 17 - 25 GHz

Pad Descriptions

v01.0803

NOTES:

1. ALL DIMENSIONS IN INCHES (MILLIMETERS)

2. ALL TOLERANCES ARE ±0.001 (0.025)

3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND

4. BOND PADS ARE 0.004 (0.100) SQUARE

5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150)

6. BACKSIDE METALLIZATION: GOLD

7. BOND PAD METALLIZATION: GOLD