MICROWAVE CORPORATION

2 - 5

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

2

Outline Drawing

v01.0304

HMC346

GaAs MMIC VOLTAGE-VARIABLE

ATTENUATOR, DC - 20 GHz

1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).

2. TYPICAL BOND PAD IS .004” SQUARE.

3. TYPICAL BOND PAD SPACING IS .006” CENTER TO

CENTER EXCEPT AS NOTED.

4. BACKSIDE METALIZATION: GOLD

5. BACKSIDE METAL IS GROUND

6. BOND PAD METALIZATION: GOLD

Pad Number

Function

Description

Interface Schematic

1, 2

RF1 Input,

RF2 Output

This pad is DC coupled and matched to 50 Ohm. Blocking

capacitors are required if RF line potential is not equal to 0V.

3, 6

V2, V1

Control Input (Master).

4

I

Control Input (Slave).

5

500

This pad must be DC grounded.

GND

Die bottom must be connected to RF ground.

Pad Descriptions