| Electronic Components Datasheet Search |
|
MAAM-010355-000000 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc. |
|
|
|||||||||||||||||||||||||||||
MAAM-010355-000000 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc. |
|
3 / 10 page ![]() CATV Power Doubler 45 - 1200 MHz Rev. V1 MAAM-010355 3 3 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 3 Absolute Maximum Ratings10,11 10. Exceeding any one or combination of these limits may cause permanent damage to this device. 11. MACOM does not recommend sustained operation near these survivability limits. Parameter Absolute Maximum RF Input Power 12 dBm Voltage 30 V Storage Temperature -65°C to +150°C Printed Circuit Board (PCB) Thermal Design To maintain reliable junction temperatures for this high power amplifier the printed circuit board must provide low thermal resistance to the exposed paddle of the IC package. Two PCB thermal solutions are presented below. In general, thinner substrates and thicker plating for vias provide lower thermal resistance. Calculation of case temperature must include temperature rise in PCB. For additional details and support please contact https://www.macom.com/support 8. These operating conditions will ensure MTTF > 1 x 106 hours. 9. Junction Temperature (TJ) = Case Temperature (TC) + Өjc*(V*I) Typical thermal resistance (ӨJC) = 3.8 °C/W. a) For TC = 25°C, TJ = 66°C @ 24 V, 445 mA b) For TC = 100°C, TJ = 141°C @ 24 V, 445 mA Pedestal Heat Sink Chassis PCB PCB U1 PCB Cut-Out with Thermal Pedestal 139 total vias. Vias plated to 2-mil (50 µm) thickness of copper. Finished via diameter 10 mils (0.25 mm). Via spacing 20 mils (0.51 mm). 2.8-mil (70 µm) thick copper for top and bottom metal. PCB thermal resistance (ӨPCB) = 1.7 °C/W, measured. For base temperature (TB) = +85°C, 24 V & 445 mA, TJ = TB + ( ӨPCB + ӨJC ) * V * I = +144°C Maximum Operating Conditions8 Parameter Maximum Operating Condition RF Input Power 5 dBm Voltage 24 V Junction Temperature9 +160°C Thermal Via Array, 62-mil PCB |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |