(125 - 50) °C

5.3 W

< 14.15

°C

W

8

350 kHz x 200 mV

8 28 µF

10A x

x 1 -

3.3V

12V

3.3V

12V

¹

·

©

§

¹

·

©

§

8

LMZ13610

www.ti.com

SNVS709G – MARCH 2011 – REVISED DECEMBER 2015

One recommended output capacitor combination is two 330-

μF, 15-mΩ ESR tantalum polymer capacitors

connected in parallel with a 47-uF 6.3-V X5R ceramic. This combination provides excellent performance that may

exceed the requirements of certain applications. Additionally some small 47-nF ceramic capacitors can be used

for high-frequency EMI suppression.

The LMZ13610 module contains two internal ceramic input capacitors. Additional input capacitance is required

external to the module to handle the input ripple current of the application. The input capacitor can be several

capacitors in parallel. This input capacitance must be located in very close proximity to the module. Input

capacitor selection is generally directed to satisfy the input ripple current requirements rather than by

capacitance value. Input ripple current rating is dictated by Equation 10:

where

•

D

(10)

As a point of reference, the worst case ripple current will occur when the module is presented with full load

Recommended minimum input capacitance is 30-µF X7R (or X5R) ceramic with a voltage rating at least 25%

higher than the maximum applied input voltage for the application. It is also recommended that attention be paid

to the voltage and temperature derating of the capacitor selected.

NOTE

Ripple current rating of ceramic capacitors may be missing from the capacitor data sheet

and you may have to contact the capacitor manufacturer for this parameter.

If the system design requires a certain minimum value of peak-to-peak input ripple voltage (

maintained then Equation 11 may be used.

(11)

If

(12)

Additional bulk capacitance with higher ESR may be required to damp any resonant effects of the input

capacitance and parasitic inductance of the incoming supply lines. The LMZ13610 typical applications schematic

and evaluation board include a 150-

μF 50-V aluminum capacitor for this function. There are many situations

where this capacitor is not necessary.

Another way to estimate the temperature rise of a design is using

copper areas and airflows can be found in the Typical Characteristics. If our design required the same operating

conditions as before but had 225 LFPM of airflow. We locate the required

(13)

On the

inches. The airflow reduced the required heat sinking area by a factor of three.

To reduce the heat sinking copper area further, this package is compatible with D3-PAK surface mount heat

sinks.

For an example of a high thermal performance PCB layout for SIMPLE SWITCHER power modules, refer to AN-

2093 (SNVA460), AN-2084 (SNVA456), AN-2125 (SNVA473), AN-2020 (SNVA419) and AN-2026 (SNVA424).

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