MICROWAVE CORPORATION

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12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

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10

SMT GaAs HBT MMIC

DIVIDE-BY-8, DC - 18 GHz

HMC494LP3

Evaluation PCB

List of Materials

The circuit board used in the final application should use

RF circuit design techniques. Signal lines should have

50 ohm impedance while the package ground leads

and backside ground slug should be connected directly

to the ground plane similar to that shown. A sufficient

number of via holes should be used to connect the top

and bottom ground planes. The evaluation circuit board

shown is available from Hittite upon request. This evalu-

ation board is designed for single ended input testing. J2

and J3 provide differential output signals.

v01.0604

Item

Description

J1 - J3

PC Mount SMA RF Connector

J4, J5

DC Pin

C2 - C5

100 pF Capacitor, 0402 Pkg.

C6

1000 pF Capacitor, 0603 Pkg.

C1

2.2 uF Tantalum Capacitor

U1

HMC492LP3 Divide-by-2

PCB*

107197 Eval Board

* Circuit Board Material: Rogers 4350