TLP281 datasheet(8/10 Pages) ISOCOM

8 / 10 page

8 15/11/2013

DC93174

IS3H7

ISOCOM

COMPONENTS

IR REFLOW SOLDERING TEMPERATURE PROFILE

(One Time Reflow Soldering is Recommended)

Profile Details

Conditions

Preheat

- Min Temperature (TSMIN)

- Max Temperature (TSMAX)

- Time TSMIN to TSMAX (ts)

150°C

200°C

60s ̶ 120s

Soldering Zone

- Peak Temperature (TP)

- Liquidous Temperature (TL)

- Time within 5°C of Actual Peak Temperature (TP ̶ 5°C)

- Time maintained above TL (tL)

- Ramp Up Rate (TL to TP)

- Ramp Down Rate (TP to TL)

260°C

217°C

30s

60s ̶ 100s

3°C/s max

6°C/s max

Average Ramp Up Rate (Tsmax to TP)

3°C/s max

Time 25°C to Peak Temperature

8 minutes max

TIME (s)

25°C

ts Preheat

60s – 120s

Tsmin

Tsmax

260°C

217°C

Time 25°C to Peak Temperature

TP - 5°C

Max Ramp Up Rate

3°C/s

Max Ramp Down Rate

6°C/s

200°C

150°C

TLP281 Datasheet(PDF) 8 Page - ISOCOM COMPONENTS

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