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2

REV.02 20130927

BAW56T

Typical Soldering Pattern:

MILLIMETERS

INCHES

DIM

MIN

MAX

MIN

MAX

A

0.70

0.90

0.028

0.035

A1

0.00

0.10

0.000

0.004

A2

0.70

0.80

0.028

0.031

b1

0.15

0.25

0.006

0.010

b2

0.25

0.35

0.010

0.014

c

0.10

0.20

0.004

0.008

D

1.50

1.70

0.059

0.067

E

0.70

0.90

0.028

0.035

E1

1.45

1.75

0.057

0.069

e

0.50 TYP.

0.020 TYP.

e1

0.90

1.10

0.035

0.043

L

0.40 REF.

0.016 REF.

L1

0.10

0.30

0.004

0.012

θ

0

O

8

O

0

O

8

O

NOTES:

1. Above package outline conforms to JEITA EAIJ ED-7500A SC-75A.

2. Dimensions are exclusive of Burrs, Mold Flash & Tie Bar extrusions.

PACKAGE OUTLINE & DIMENSIONS