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2

REV.02 20141224

DEVICE CHARACTERISTICS

YSESDAxxCT Series

(V)

(V)

@1A

(µA)

(pF)

(max.) (min.)

(mA)

(max.) (max.)

(@A)

(max.)

(typ.)

DT

5

6

1

9.8

YSESDA33CT

CT

3.3

4

1

7

12

8

1

10

20

5

1

10

YSESDA08CT

GT

8

8.5

1

17.5

25

3

1

7

YSESDA05CT

PART NUMBER

DEVICE

MARKING

260 (10 sec.)

℃

Lead Soldering Temperature

Operating Temperature Range

ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)

Watts

PARAMETER

SYMBOL

VALUE

100

Storage Temperature Range

-55 ~ 150

℃

UNITS

Peak Pulse Power (tp=8/20µs waveform)

-55 ~ 150

℃

MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)

100

W

DC Power Dissipation @TL=75℃(Note 2)

Derate above 75℃

Thermal Resistance,Junction-to-Lead

PD

700

8

50

mW

mW/℃

℃/W

DC Power Dissipation @TA=25℃ (Note 2)

Derate above 25℃

Thermal Resistance, Junction-to-Ambient

PD

500

4

250

mW

mW/℃

℃/W

Note 1. Non-repetitive current pulse at TA=25℃, Power waveform = 8/20μs.

Note 2. Mounted with 1 inch Copper pad size, DC board FR-4.