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SN74LVC2G14DBVT Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC2G14DBVT Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 15 page ![]() www.ti.com FEATURES DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 6 5 4 1A GND 2A 1Y VCC 2Y 3 2 1 4 5 6 2A GND 1A 2Y VCC 1Y YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) DESCRIPTION/ORDERING INFORMATION SN74LVC2G14 DUAL SCHMITT-TRIGGER INVERTER SCES200J – APRIL 1999 – REVISED JUNE 2005 • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages • Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Max tpd of 5.4 ns at 3.3 V • Low Power Consumption, 10- µA Max I CC • ±24-mA Output Drive at 3.3 V • Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C • Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C • Ioff Feature Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation. NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74LVC2G14YEAR 0.17-mm Small Bump – YEA NanoFree™ – WCSP (DSBGA) SN74LVC2G14YZAR 0.17-mm Small Bump – YZA (Pb-free) Reel of 3000 _ _ _CF_ NanoStar™ – WCSP (DSBGA) SN74LVC2G14YEPR 0.23-mm Large Bump – YEP –40°C to 85°C NanoFree™ – WCSP (DSBGA) SN74LVC2G14YZPR 0.23-mm Large Bump – YZP (Pb-free) Reel of 3000 SN74LVC2G14DBVR SOT (SOT-23) – DBV C14_ Reel of 250 SN74LVC2G14DBVT Reel of 3000 SN74LVC2G14DCKR SOT (SC-70) – DCK CF_ Reel of 250 SN74LVC2G14DCKT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 1999–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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