TDA8922TH datasheet(2/36 Pages) PHILIPS

2 / 36 page

2003 Mar 20

Philips Semiconductors

Objective speciﬁcation

× 25 W class-D power ampliﬁer

TDA8922

CONTENTS

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

FUNCTIONAL DESCRIPTION

8.1

General

8.2

Pulse width modulation frequency

8.3

Protections

8.3.1

Overtemperature

8.3.2

Short-circuit across loudspeaker terminals and

to supply lines

8.3.3

Start-up safety test

8.3.4

Supply voltage alarm

8.4

Differential audio inputs

LIMITING VALUES

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

STATIC CHARACTERISTICS

SWITCHING CHARACTERISTICS

DYNAMIC AC CHARACTERISTICS (STEREO

AND DUAL SE APPLICATION)

DYNAMIC AC CHARACTERISTICS (MONO

BTL APPLICATION)

APPLICATION INFORMATION

16.1

BTL application

16.2

Pin MODE

16.3

Output power estimation

16.4

External clock

16.5

Heatsink requirements

16.6

Output current limiting

16.7

Pumping effects

16.8

Reference design

16.9

PCB information for HSOP24 package

16.10

Classification

16.11

Bill of materials for reference design

16.12

Curves measured in reference design

16.13

Application schematics

PACKAGE OUTLINE

SOLDERING

18.1

Introduction

18.2

Through-hole mount packages

18.2.1

Soldering by dipping or by solder wave

18.2.2

Manual soldering

18.3

Surface mount packages

18.3.1

Reflow soldering

18.3.2

Wave soldering

18.3.3

Manual soldering

18.4

Suitability of IC packages for wave, reflow and

dipping soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

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